China’s semiconductor sector achieves breakthroughs under high pressure: Domestic substitution achieved in chip etching, packaging and other fields | chips | China semiconductors | China-U.S. _ Sina Technology _ Sina.com

China’s semiconductor sector is making remarkable progress despite intense pressure from U.S. export controls. Domestic substitution has been achieved in critical areas like chip etching and packaging, signaling a major shift in the global tech landscape.

The country’s chipmakers have focused on mastering advanced manufacturing processes that were once dominated by Western firms. This self-reliance is not just a strategic necessity but a direct response to tightening trade restrictions.

One key breakthrough lies in chip etching, a process that carves intricate patterns onto silicon wafers. Chinese companies now offer competitive solutions that match the precision of industry leaders like ASML and Applied Materials.

Similarly, advanced packaging technologies have seen rapid local development, allowing chips to be stacked and connected more efficiently. This reduces the need for cutting-edge lithography, giving China a practical workaround for current limitations.

These achievements show that high pressure can accelerate innovation rather than stifle it. The U.S.-China tech rivalry is now forcing both sides to rethink their dependencies and strengths.

As domestic alternatives mature, the global semiconductor supply chain will inevitably become more fragmented. For consumers and businesses worldwide, this means more choices but also greater uncertainty in how chips are sourced and priced.