How Can China Break Through the Chip Chokepoint Problem? - Zhihu

China’s tech sector faces a critical bottleneck as the United States tightens export controls on advanced semiconductors. The answer to this chokepoint problem is not simply buying more time, but rather accelerating domestic innovation across the entire chip ecosystem.

The most direct path forward lies in doubling down on heterogeneous integration and advanced packaging technologies. By stacking chips and connecting them efficiently, Chinese firms can achieve performance gains without relying on the most extreme nanometer-scale lithography.

At the same time, the rise of Chinese AI models like DeepSeek and Kimi offers a powerful software-driven workaround. These models are being optimized to run efficiently on less advanced hardware, reducing the demand for cutting-edge chips and creating a virtuous cycle of demand for domestic alternatives.

Hardware breakthroughs are also emerging from unexpected places. Companies like Huawei are making strides with their own chip designs, while new materials and architectures, such as photonic computing, are being explored to leapfrog traditional silicon limitations.

The geopolitical landscape adds urgency but also opportunity. The chip war is forcing China to build a self-reliant supply chain, from raw materials to manufacturing equipment, which could ultimately create a more resilient and innovative domestic industry.

Ultimately, breaking the chokepoint is a long-term marathon, not a sprint. By combining software optimization, novel hardware designs, and a determined push for self-sufficiency, China is laying the groundwork for a future where it is no longer dependent on foreign chip technology.